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updated January 18, 2010
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Alumnus Robert Patti Honored as Semiconductor Pioneer
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Rose-Hulman Institute of Technology physics and electrical engineering
alumnus Robert Patti has been recognized by SEMI for his pioneering work in
the emerging technical area of 3D integrated circuit integration. He
received the SEMI Award for North America, the association’s highest honor
for technical contribution to the semiconductor industry.
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Robert Patti |
Patti, chief technology officer of Tezzaron, Inc. of Naperville, Ill., is
recognized as one of the most knowledgeable and hands-on practitioners of 3D
IC development. He is a leader in the current global discussions charting
the direction of 3D ICs.
Patti was among the first to identify some of the limitations associated
with certain copper through-silicon via (TSV) structures and potential
solutions. He has been the main driver for the 3D-IC Alliance, which has
produced the first published standard for three-dimensional chip designs: a
specification for integrating memory and logic in a 3D stack. This standard
lays the cornerstone for memory-to-logic 3D integration and establishes a
basis for future collaborative efforts in the industry.
After graduating from Rose-Hulman in 1985, Patti founded a research and
development company specializing in high-performance systems and ASICs and
participated in the design of over 100 chips in the course of 12 years.
Tezzaron Semiconductor grew from that company to become a leading force in
3D-IC technology.
Today, Patti uses wafer-level stacking processes to create ultra
high-density 3D memory products and other semiconductor sub-components. He
is vice chairman of JEDEC's DDRIII/Future Memories Task Group and holds 14
U.S. patents, numerous foreign patents, and many more pending patent
applications in deep sub-micron semiconductor chip technologies.
The SEMI emerging technology award is presented to the individual or team
for recognition of early stage development of a concept that has been shown
by a reduction to practice a system, process or material which has the
promise of significant value to the future development of the semiconductor
industry.
The industry honor was presented at the 2010 SEMI Industry Strategy
Symposium in Half Moon Bay, Calif., on January 12.
The SEMI Award was established in 1979 to recognize outstanding technical
achievement and meritorious contribution in the areas of semiconductor
materials, wafer fabrication, assembly and packaging, process control, test
and inspection, robotics and automation, quality enhancement, and process
integration.
Listen to a recent audio interview with Patti, conducted by Brightspot, at
http://www.semineedle.com/node/22983?snc=20639
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