ME416
Intro to MEMS: Fabr & Appl

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Catalog Description: (Prerequisities - Junior class standing) Properties of silicon wafers, wafer-level processes, surface and bulk micromachining, thin-film deposition, dry and wet etching, photolithography, process integration, simple actuators. Introduction to microfluidic systems. MEMS applications: capacitive accelerometer, cantilever and pressure sensor.

 

 
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Homework
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Homework

Si as a Mechanical Element:

Problem Hint Answer
Prob. 1 This is an example of uniaxial stress/strain. d) 0.032 N
Prob. 2 The total strain is the sum of two pieces: the mechanical part (plain old e - the one related to s) and the thermal piece (eT). What must the total strain be?
Note that all stress and strain is in the axial direction.		 b) 379.5 kPa


Mechanical Properties of Thin Films:

Problem Hint Answer
Prob. 1 Should be straight forward. a) -162 MPa
Prob. 2 Draw some triangles and keep your wits about you to find that radius of curvature. b) 178 MPa


Basic Heat Transfer and Thermal Actuation:

Problem Hint Answer
Prob. 1 Note this error in the problem statement: h has units of W/m2-°C, not W/m-°C.
I didn't ask for it in the problem, but you should also be able to calculate the heat transfer rate.
If your temperature answer troubles you, then calculate a Biot number and think about what that means.		 Qdot = 21.2 W
Prob. 2 Part a) is more conceptual than it is calculation intensive. The resulting expression is simple.
 b)ηbigfin=0.852, ηmicrofin=?