ME416
Intro to MEMS: Fabr & Appl

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Catalog Description: (Prerequisities - Junior class standing) Properties of silicon wafers, wafer-level processes, surface and bulk micromachining, thin-film deposition, dry and wet etching, photolithography, process integration, simple actuators. Introduction to microfluidic systems. MEMS applications: capacitive accelerometer, cantilever and pressure sensor.

 

 
Topics
Homework
Other Stuff
 
 
 
 

Mechanical and Thermal Property Topics

INSTRUCTOR

Dr. Tom Thomas Adams
thomas.m.adams@rose-hulman.edu
Dept: ME
Phone: 872-6089
Office: Moench C110


TOPICS

Topic References Description
Silicon as a Mechanical Element Chapter 3.1, Madou pages 195-200, 204-205 Solid mechanics issues with silicon: Stress and strain, Elasticity, Thermal expansion
Mechacinal Properties of Thin Films Chapter 4.1, Madou pages 261-272 Adhesion; Stress: Types and causes, thermal stress
Heat Transfer & Thermal Accuation Chapter 5.1-5.2, Madou pages 587-593 Basic heat transfer concepts, lumped model of thermal actuator

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ACADEMIC HONESTY

Any act of academic misconduct is grounds for discipline in accordance with the most recent edition of the Rose-Hulman Institute of Technology Academic Rules and Procedures. If in doubt, ASK! The most recent information can be found on the web at http://www.rose-hulman.edu/Users/groups/Registrar/arap/rules00.htm. Specific guidance about collaboration and the use of files is found below under Homework Guidelines.


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