Professors Bunch, Ditteon, Duree, Granieri, Joenathan, E. Kirkpatrick, S. Kirkpatrick, Kirtley, Leisher,Letfullin, Liptak, McInerney, Moloney, Siahmakoun, Syed, and Wagner.

NOTE: In courses which include a laboratory, satisfactory completion of the laboratory work is required in order to pass the course.

EP 280 Introduction to Nano-engineering   3.5R-1.5L-4C   W   
Scaling laws in small systems; electronics and photonics devices and systems, basics of quantum and statistical mechanics, nanomaterials and fabrication: examples of zero, one, two, and three dimensional nanostructures, carbon nanotubes, Nanoelectronics: basics of solid state physics; electron energy band, semiconductors, tunneling and quantum structures, molecular electronics, Nanophotonics in metals and semiconductors, surface plasmon resonance and applications, photonic bandgap crystals.

EP 290 Directed Study   Credit arranged   Prereq: Consent of instructor
Research for freshmen and sophomore students under the direction of a physics or optical engineering faculty member. May earn up to a maximum of 2 credits for meeting the graduation requirements. The student must make arrangements with a faculty member for the research project prior to registering for this course.

EP 330 Material Failure   3R-3L-4C   W   Prereq: PH112
Principles of material failure; appearance, physical cause and mathematical description with emphasis on the materials used for micro-scale devices and assemblies. Failure types considered include Rupture, Fatigue, Creep, Corrosion, Electromigration, Electrical Overstress, Electrical Discharge and Thermal. Experiments illustrate the failure type and the machines used to study them. These include Electron, Optical and X-ray microscopes, Spectroscopy and Tension machines. A brief description of the working of each machine will be given.

EP 380 Nanotechnology, Entrepreneurship and Ethics   3.5R-1.5L-4C   S 
Scaling laws in small systems; mechanical, biological, fluidics, and thermal systems. Nanomaterials and nanofabrication. Nanomechanics: cantilever oscillation, atomic-force microscopy (AFM) and its applications, nano-biotechnology, machinery of cell, and molecular motors. Nanoscale optics, Nanoscale heat: conduction, convection, and blackbody radiation. Basics of fluidics, nanoscale fluidics and applications, entrepreneurship and ethics, concepts and tools in innovation and social impacts of nanotechnology.

EP 406 Semiconductor Devices and Fabrication   3R-3L-4C  W  Prereq: PH405 or ECE250
Metal-semiconductor interfaces; photoresist and photolithography; thin film deposition; design and fabrication of semiconductor diodes; characterization of process diodes and transistors; MOSFETS; optoelectronic devises and lasers. Laboratory is a design project, the production and characterization of a diode and bipolar transistor. The project is a team exercise. Cross-listed with EP 506.

EP 407 Semiconductor Fabrication & Characterization  2R-6L-4C  F  Prereq: PH405 or JR/SR standing & consent of instructor  
Fabrication and characterization of micro/nanoelectronic devices; Semiconductor devices; Oxidation, ion implantation, etching, deposition, lithography, and back-end processing; Process integration of various technologies, including CMOS, double poly bipolar junction transistor, and GaAs MESFET. Process and device simulators illustrate concepts introduced in class.  Modern tools/techniques for both bulk- and thin-film characterization; Laboratory is an integral component of this class.  Students work in teams to fabricate a multi-junction semiconductor device, using various techniques which include photolithography, diffusion, oxidation, and etching. In-process measurement results are compared with final electrical test results. Circuits are used to carry out performance evaluation.   

EP 408 Microsensors   3R-3L-4C  S  Prereq: JR or SR standing, and consent of instructor
Introduction to solid state materials and conventional silicon processing. Measurement of signals from resistance- and capacitance-based transducers; sensor characteristics, calibration and reliability. Examples of microsensors: thermal, radiation, mechanical, chemical, optical fibers, and biological. Cross-listed with EP 508.

EP 410 Introduction to MEMS: Fabrication and Applications   3R-3L-4C  S  Prereq: JR or SR standing
Properties of silicon wafers, wafer-level processes, vacuum systems, thin-film deposition via PVD, dry and wet etching, photolithography, surface and bulk micromachining, process integration, MEMS applications: heat actuators, capacitive accelerometer, DLP, bio-sensor, and pressure sensor. Cross-listed with ME 416, ECE 416, and CHE405.

EP 411 Advanced topics in MEMS   3R-3L-4C  F  Prereq: EP410 or equivalent course
Topics such as: Microlithography, design process, modeling; analytical and numerical. Use of software for layout design and device simulation. Characterization and reliability of MEMS devices. MEMS and microelectronic packaging. Introduction to microfluidic systems. Applications in engineering, biomedicine, and chemistry. Cross-listed with ECE 419, and CHE 419.

EP 415 Engineering Physics Design I  2R-6L-4C  S  Prereq: OE 280 or EP 280 & JR/SR standing  Coreq: RH 330
Principles of design. Codes of ethics appropriate to engineers. Case studies related to optical engineering and engineering physics professional practice, teamwork, contemporary issues, patents and intellectual property. Team-oriented design project work on selected topics in optical engineering and engineering physics. Introduction to product development practices, product research, planning and project management. Preliminary design of a product and product specifications. Deliver a design document specific to customer needs and constraints. Cross-listed with OE 415.

EP 416 Engineering Physics Design II   2R-6L-4C   F   Prereq: EP 415 
Team-based capstone design project following structured design processes and utilizing knowledge gained from prior coursework. Project planning and budgeting, development of product/process specifications, application of engineering standards, system design and prototyping subject to multiple realistic constraints (cost, schedule, and performance). Formal midterm design review. Deliver initial statement of work and interim technical report. Laboratory activities supporting the formal design process. Cross-listed with OE 416.

EP 417 Engineering Physics Design III  2R-6L-4C  W  Prereq: EP 416
Continuation of EP 416. System design and prototyping, performance testing, and data analysis. Formal midterm design review. Demonstration of a functional prototype. Deliver oral presentation and final technical report. Cross-listed with OE 417.

EP 470 Special Topics in Engineering Physics  2-4 Credits  Prereq: Consent of instructor
Lectures on special topics in engineering physics.

EP 490 Directed Study   Credit arranged   Prereq: Consent of instructor
Research for junior and senior students under the direction of a physics and optical engineering faculty member. May earn up to a maximum of 2 credits for meeting the graduation requirements. The student must make arrangements with a faculty member for the research project prior to registering for this course.

EP 506 Semiconductor Devices and Fabrication   3R-3L-4C  W  Prereq: PH405 or ECE250
Metal-semiconductor interfaces; photoresist and photolithography; thin film deposition; design and fabrication of semiconductor diodes; characterization of process diodes and transistors; MOSFETS; optoelectronic devises and lasers. Laboratory is a design project, the production and characterization of a diode, bipolar transistor and MOSFET. The project is a team exercise. Students must do additional project work on a topic selected by the instructor. Cross-listed with EP 406.

EP 507 Semiconductor Fabrication and Characterization  2R-6L-4C  F  Prereq: PH405 or consent of instructor
Fabrication and characterization of micro/nanoelectronic devices; Semiconductor devices; Oxidation, ion implantation, etching, deposition, lithography, and back-end processing; Process integration of various technologies, including CMOS, double poly bipolar junction transistor, and GaAs MESFET. Process and device simulators illustrate concepts introduced in class.  Modern tools/techniques for both bulk- and thin-film characterization; Laboratory is an integral component of this class.  Students work in teams to fabricate a multi-junction semiconductor device, using various techniques which include photolithography, diffusion, oxidation, and etching. In-process measurement results are compared with final electrical test results. Circuits are used to carry out performance evaluation.  Students must do additional project work on a topic selected by the instructor. Students may not receive credit for both EP 407 and EP 507.

EP 508 Microsensors   3R-3L-4C  S  Prereq: JR or SR standing, and consent of instructor
Introduction to solid state materials and conventional silicon processing. Measurement of signals from resistance- and capacitance-based transducers; sensor characteristics, calibration and reliability. Examples of microsensors: thermal, radiation, mechanical, chemical, optical fibers, and biological. Students must do additional project work on a topic selected by the instructor. Cross-listed with EP 408.

EP 510 Introduction to MEMS: Fabrication and Applications   3R-3L-4C  S  Prereq: JR or SR standing
Properties of silicon wafers, wafer-level processes, vacuum systems, thin-film deposition via PVD, dry and wet etching, photolithography, surface and bulk micromachining, process integration, MEMS applications: heat actuators, capacitive accelerometer, DLP, bio-sensor, and pressure sensor. Students must do additional project work on a topic selected by the instructor. Cross-listed with BE 516, CHE 505, ECE 516, and ME 516.

EP 511 Advanced topics in MEMS   3R-3L-4C  F  Prereq: EP410/510 or consent of instructor
Topics such as: Microlithography. Design process, modeling; analytical and numerical. Use of software for layout design and device simulation. Characterization and reliability of MEMS devices. MEMS and microelectronic packaging. Introduction to microfluidic systems. Applications in engineering, biomedicine, and chemistry. Students must do additional project work on a topic selected by the instructor. Cross-listed with ME 519, ECE 519, and CHE 519.

EP Electives:
Courses from any science or engineering department which are of relevant level to the area concentration. If not in the area concentration, courses should be 300 level or above. It is recommended that students take a sequence of classes from the area concentration. This will fulfill engineering science elective in their engineering curriculum.